Key capabilities

  • Layer Counts: 2 – 24
  • Board Thickness: 0.4 – 2.0mm
  • Panel Size: 18*24″, 20*24″, 21*24
  • Laminated Structure (1-n-1 to any layer)
  • Copper Thickness: H oz – >1 oz + plating
  • Min Line Width/Spacing: 2/2mil
  • Min Core Thickness: 2mil
  • Impedance Control: +/- 10%
  • Min Mechanical Drilling: 8mil (AR 10:1)
  • Min Laser Drilling: 3mil (AR 0.8:1)
  • Low DK & DF Material
  • VOP & Plated Hole Filling
  • Board Edge Wall Plating Technology