High Density Interconnects (HDI) PCBs

High density interconnects (HDI) PCB, represent one of the fastest-growing technologies in PCBs. Because of its higher circuitry density than traditional circuit boards, the HDI PCB design can incorporate smaller vias and capture pads, and higher connection pad densities. HDI Boards contain blind and buried vias and often contain micro vias of 0.006 or less in diameter.

CONTACT US
PCB Manufacturing

What is HDI PCB

By using HDI technology, designers now can place more components on both sides of the raw PCB if desired. Now as the development of via in pad and blind via technology, it allows designers to place smaller components closer together.


This means faster transmission of signals and a significant reduction in signal loss and crossing delays.

PCB Manufacturing

HDI PCB is frequently found in mobile phones, touch-screen devices, laptop computers, digital cameras, 4G network communications, also prominently featured in medical devices.

Advantages of HDI PCB

The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.


Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.

Function improved by HDI PCB:

Denser trace routing

More stable power

Reduce interference inductance and capacitance effects

Improve signal integrity in high-speed design

PCB Manufacturing

Accelerate Development with HDI Printed Circuit Boards

01

Easier to place SMD components

02

Faster routing

04

More component space (also by Via-in-Pad)

03

Reduce frequent relocation of components

Check AlteraFLex HDI PCB manufacturing capabilities in the following table:

Feature Capability
Number of Layers 4-30 layer
Quality Grade IPC 6012 Class 2,IPC 6012 Class 3
Material Tg 140°C FR4,Tg 150°C FR4,Tg 170°C FR4 ,Special material
Thickness 0.4-6.0mm
Min Track/Spacing Inner layer: Part 2 / 2mil, overall 3 / 3mil (H/H OZ base copper) Outer layer: Part 2.5/2.5mil, overall 3 / 3mil(H/H OZ base copper)
Min Hole Size 0.15mm-0.3mm
Solder Mask Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green
Silkscreen White, Black,Yellow,Blue
Surface Finish Immersion gold,OSP,Hard gold,Immersion Silver
Finished Copper 0.5-13oz
Build time 5-10 days

Have Questions?

If you have any questions or need any further information, please feel free to contact your dedicated customer service.

Contact Us Now!
Share by: