Rework & Reballing Services

Our high-reliability BGA Reballing service can quickly rework BGA components that require reballing. 

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Circuit Card Assembly

PCBA Rework Services

Our PCBA rework services can extend the life of your electronic assemblies, reduce your costs, and improve product reliability. We specialize in identifying and correcting any issues that may arise after the initial assembly process.

Our Process:

If you require reballing services for your BGA component parts, you’ve come to the right place. AlteraFlex Circuits can easily manage all your BGA component reballing needs. Contact us whenever you need BGA component reballing, and we will take care of you right away. We are also happy to answer any questions about the reballing process you may have.

1. Fault Detection

  • Thorough Inspections: Using state-of-the-art equipment, our inspection processes can pinpoint defects.
  • Expert Testing: Our electrical tests ensure every component functions exactly as intended.

 

2. Precision Rework

  • Component Care: We carefully remove and replace faulty components with no impact on the surrounding circuitry.
  • Clean & Prep: The area is meticulously cleaned to prepare for soldering of the new parts.

 

3. Quality Assurance

  • Detailed Testing: Post-rework testing confirms that the board meets all specifications and performs optimally.
  • Final Review: A comprehensive quality check ensures your product returns to you in functional condition.

 

4. Documentation

  • Transparent Reporting: We provide detailed rework reports which offer insights on how to enhances your products reliability.
Circuit Card Assembly

BGA Reballing Services

Discover how our BGA reballing services can help you save on costs and avoid the need for costly replacements. Ideal for addressing issues with solder balls in ball grid array (BGA) packages, our process ensures your devices achieve maximum durability and functionality.

Our Process:

Our high-reliability BGA Reballing service can quickly rework BGA components that require reballing. Reballing is often required when the alloy of the BGA component solder balls needs to be changed from lead-free to leaded. Every BGA Reballing project is completed to meet IPC and JEDEC specifications.

1. BGA Assessment

  • Careful Removal: We safely detach the BGA chip using controlled heating techniques, preserving the integrity of the PCB.
  • Detailed Inspection: The BGA and PCB are thoroughly inspected for any potential issues before proceeding.

 

2. Reballing

  • Solder Ball Replacement: New, high-quality solder balls are precisely placed using advanced alignment techniques.
  • Secure Reflow: We ensure a strong, reliable bond with professional reflow soldering.

 

3. Reintegration and Testing

  • Accurate Placement: The reballed BGA is expertly reattached to the PCB.
  • Rigorous Testing: Extensive functional tests confirm the BGA’s functionality and the assembly’s overall integrity.

 

4. Final QA and Documentation

  • Quality Checks: Our strict quality assurance process guarantees the repair's durability.
  • Comprehensive Documentation: Receive a full report detailing the reballing process and the improvements made to your component.

 

Why Choose Us?

  • Customer-Centric Approach: We focus on providing solutions that meet your specific needs and timelines.
  • Expert Technicians: Our team consists of experienced professionals dedicated to the highest standards of quality.
  • Cost-Effective Solutions: We help you save on costs by repairing rather than replacing, extending the lifespan of your products.

Have Questions?

If you have any questions or need any further information, please feel free to contact your dedicated customer service.

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