Advantages:
- Reduced deterministic jitter
- Lower bit error rate (BER)
- Less signal attenuation with improved impedance matching
- Minimal design and layout impact
- Increased channel bandwidth
- Increased data rates
- Reduced EMI/EMC radiation from the stub end
- Reduced excitation of resonance modes
- Reduced via-to-via crosstalk
- Lower costs than sequential laminations
General Characteristics
- Mostly are rigid boards on the back
- Normally used on 8 layers or above
- Board thickness is over 2.5mm
- Minimum hold size is 0.3mm
- Backdrill is 0.2mm larger than the vias
- Tolerance of backdrill depth+/-0.05MM
Have Questions?
If you have any questions or need any further information, please feel free to contact your dedicated customer service.