Mixed Assembly Advantages

Mixed Assembly Advantages

The mixed technology PCB assembly has the properties of both surface mount technology (SMT), and through-hole technology, hence the name. These assemblies are most commonly used in applications, which require the combination of both through-hole and SMT assemblies. This type of PCB assembly does not use any solder paste.  We have the capability to manufacture circuit boards with single-sided, double-sided, as well as multilayer mixed technology.

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Mixed Assembly Advantages

Mixed Assembly: Through-Hole, SMT and BGA components are housed on the PCB. 

Single or double-sided mixed technology or SMT (Surface Mount) for PCB assembly Single- or double-sided BGA and micro-BGA

Installation and rework with 100% X-ray inspection

PCB board components: including all types of BGAs, QFNs, CSPs, 0201, 01005, POP, and Pressfit Components in small quantities

Part Polarity Capacitors: SMT Polarized Capacitors, and Through-Hole Polarized Capacitors 

Rework Capabilities: Removing & Replacing BGA’s & MBGA’s, Experienced with Ceramic & Plastic BGA’s, Reballing BGA’s & MBGA.

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If you have any questions or need any further information, please feel free to contact your dedicated customer service.

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