SMT Assembly Capabilities

SMT Assembly Capabilities


In surface mount SMT assembly, components are mounted directly on the PCB surface. This technique has contributed to the rising demand for miniature assemblies. We offer high-quality Surface Mount SMT PCB assembly services at cost-effective prices in faster turnarounds. With automated assembly processes, we are capable of assembling double-sided/ multilevel printed circuit boards that ensure optimum performance when used in demanding applications.

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Our production facilities can assemble the following SMT types:

Ball Grid Array (BGA)

Ultra-Fine Ball Grid Array (uBGA)

Quad Flat Pack No-Lead (QFN)

Quad Flat Package (QFP)

Small Outline Integrated Circuit (SOIC)

Plastic Leaded Chip Carrier (PLCC)

Package-On-Package (PoP)

Small Chip Packages (pitch of 0.2 mm)

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If you have any questions or need any further information, please feel free to contact your dedicated customer service.

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