Ball Grid Array (BGA)

PCB Ball Grid Array (BGA)

Ball Grid Array (BGA) is an important type of surface mount packaging employed in integrated circuit boards. BGAs are mainly used for mounting high performance devices including microprocessors. There are several BGA assembly service providers who offer these packages in different specifications. Sierra Assembly stands tall among them. We have immense experience and expertise in designing Ball Grid Array Assembly (BGA) packages. Equipped with advanced manufacturing and inspection equipment, we can produce high quality BGA circuit boards with excellent yield rates.

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Circuit Card Assembly

PCB BGA

The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. Soldering of BGA devices requires precise control and is usually done by automated processes. BGA devices are not suitable for socket mounting.

AlteraFlex BGA technology:

According to our prototype factory's production capability, the diameter of BGA pad (round one below) should be at least 0.25mm, the space between copper trace and BGA PAD should be at least 0.15mm, BGA to Pad should be not less 0.15mm(1OZ complete copper thickness),BGA Pad to BGA Pad should be not less 0.35mm.

AlteraFlex advanced PCB factory can now manufacturing abilities:

The minimum diameter of BGA is 0.2MM (the sample limit can be 0.15MM), the minimum BGA to line is 3MIL (the prototype limit can be 2.5MIL), the BGA spacing limit is 0.4mm, and the conventional 0.5mm Challenges to the limit are not easy to produce, because the scrap rate is too high, resulting in increased costs.

The Advantage of BGA:

  • 1. Efficient use of PCB space.

    Using BGA packages means fewer component involvement and smaller footprints, it is also help to save space for custom PCBs, which greatly increases the effectiveness of PCB space.

  • 2. Improve thermal and electrical performance.

    Due to small size of PCB base on BGA package, heat dissipation is more easily. When silicon wafer is mounted on top, most heat can be transmitted down to the ball grid. When silicon wafer is mounted on the bottom, the backside of the silicon wafer connect to the top of the package and is considered to be one of the best heat dissipation methods. The BGA package has no pins that can be bent and broken, which makes it stable enough to ensure large-scale electrical performance.

  • 3. Improve manufacturing profit based on welding improvement.

    Most BGA package pads are large, which makes large area soldering easier and more convenient. As a result, the manufacturing speed of PCB increased with the increase of manufacturing yield. In addition, when using larger pads, it is easily to re-work.

  • 4. Less damage

    BGA leads consist of solid solder balls that are not easily damaged during operation.

  • 5. Reduce costs

    All advantages shown above help to reduce costs. Efficient use of PCB space provides opportunities to save material, while improving thermoelectric performance helps ensure the quality of electronic components and reduce defects.

Have Questions?

If you have any questions or need any further information, please feel free to contact your dedicated customer service.

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