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Flex Stack-Up

Stack-up for FPC

The following is the usual FPC stackup information. If you need custom FPC stackup, please make note and we will manufacture according to your requirement.

Polyimide (PI) is the most commonly used thermal curing insulating material in flexible circuit processing. The thickness range of the material is generally 12.5μm (0.5mil) and 125μm (5mil). Divided into with glue and without glue, the DK with glue is 3.5, and the DK without glue is 3.3.

Layer Buildup

Single layer FPC stackup


top coverlay	PI	12.5um
	Adhesive	15um
top copper layer	Copper	18um(Finished Copper thickness 18um
	Adhesive	13um
	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
Total thickness		83.5um

2 layer FPC stackup


top coverlay	PI	12.5um
	Adhesive	15um
top copper layer	Copper	18um(Finished Copper thickness 18um
	Adhesive	13um
	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
Total thickness		83.5um

4 layer FPC stackup


top coverlay	PI	12.5um
	Adhesive	15um
top copper layer	Copper	12um(Finished Copper thickness 18um)
	Adhesive	0um
	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
	Pure gum	13um
copper 2 layer	Copper	12um
	Adhesive	0um
	PI	25um
	Adhesive	0um
copper 3 layer	Copper	12um
	Pure gum	13um
	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
	Adhesive	0um
bottom copper layer	Copper	12um(Finished Copper thickness 18um)
bottom coverlay	Adhesive	15um
	PI	12.5um
Total thickness		204um

4 layer rigid-flex FPC stackup

	Rigid part		Flex part
	top soldermask layer	20um
rigid-top copper layer	Copper	18um(Finished Copper thickness 35um)
	FR4	680um	PI	12.5um
	Pure gum	13um	Adhesive	15um
flex-copper 2 layer	Copper	18um	Copper	18um
	Adhesive	13um	Adhesive	13um
	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
	Adhesive	13um	Adhesive	13um
flex-copper 3 layer	Copper	18um	Copper	18um
	Pure gum	13um	Adhesive	15um
	FR4	680um	PI	12.5um
rigid-bottom copper layer	Copper	18um(Finished Copper thickness 35um)
	bottom soldermask layer	20um
	Total thickness	1549um	FPC thickness	142um

6 layer FPC stackup


top coverlay	PI	12.5um
	Adhesive	15um
top copper layer	Copper	12um(Finished Copper thickness 18um)	PI	12.5um
	Adhesive	0um	Adhesive	15um
	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)	Copper	18um
	Pure gum	13um	Adhesive	13um
copper 2 layer	Copper	12um	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
	Adhesive	0um	Adhesive	13um
	PI	25um	Copper	18um
	Adhesive	0um	Adhesive	15um
copper 3 layer	Copper	12um	PI	12.5um
	Pure gum	13um
	Coverlay	27.5um
copper 4 layer	Copper	12um	FPC thickness	142um
	Adhesive	0um
	PI	25um
	Adhesive	0um
copper 5 layer	Copper	12um
	Pure gum	13um
	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
	Adhesive	0um
bottom copper layer	Copper	12um(Finished Copper thickness 18um)
bottom coverlay	Adhesive	15um
	PI	12.5um
Total thickness		293.5um

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