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Refers to the arrangement of copper layers and insulating layers that make up a PCB prior to board layout design. While a layer stack-up allows you to get more circuitry on a single board through the various PCB board layers,
The structure of PCB stack-up design confers many other advantages:
Before designing a multi-layer PCB, designers need to first determine the circuit board structure based on the size of the circuit, the size of the circuit board, and the EMC requirements. That is, decide whether to use 4 layers or 6 layers. More layers of circuit boards. After the number of layers is determined, the placement of the inner layer and how to distribute different signals on these layers are determined.
Planning the multilayer PCB stack-up configuration is one of the most important aspects in achieving the best possible performance of a product. A poorly designed substrate, with inappropriately selected materials, can degrade the electrical performance of signal transmission increasing emissions and crosstalk and can also make the product more susceptible to external noise.
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